Resource data
Modeling of and experiments characterizing electromigration-induced failures in interconnects
Andleigh, Vaibhav K. (Vaibhav Kumar), 1973-
Location:
http://hdl.handle.net/1721.1/8429
50633734
Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2001.
Belongs to: DSpace at MIT
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Detalles del recurso
|
Modeling of and experiments characterizing electromigration-induced failures in interconnects
|
| Id. |
1486931 |
| Idioma |
eng
|
| Titulo |
Modeling of and experiments characterizing electromigration-induced failures in interconnects |
| Autor(es) |
Andleigh, Vaibhav K. (Vaibhav Kumar), 1973-
|
| Location |
http://hdl.handle.net/1721.1/8429
50633734
|
| Versión |
1.0 |
| Estado |
Final
|
| Descripción |
Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2001.
|
| Tipo |
333 leaves
20585471 bytes
20585227 bytes
application/pdf
application/pdf
|
| Palabras clave |
Materials Science and Engineering.
|
| Tipo de recurso |
Thesis
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| Tipo de Interactividad |
Expositivo
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| Nivel de Interactividad |
muy bajo
|
| Audiencia |
Estudiante
Profesor
Autor
|
| Estructura |
Atomic |
| Coste |
no
|
| Copyright |
sí
|
|
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. |
| Formatos |
333 leaves
20585471 bytes
20585227 bytes
application/pdf
application/pdf
|
| Requerimientos técnicos |
Browser: Any
|
| Fecha de contribución |
07-may-2008 |
| Contacto |
|
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