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Rohsenow Symposium on Future Trends in Heat Transfer

Mostrando recursos 1 - 20 de 20

  1. A History of the MIT Heat Transfer Laboratory

    Lienhard, John H.

  2. Thermal control of electronics: Perspectives and prospects

    Hannemann, R.J.
    One of the most prominent industrial applications of heat transfer science and engineering has been electronics thermal control. Driven by the relentless increase in spatial density of microelectronic devices, integrated circuit chip powers have risen by a factor of 100 over the past twenty years, with a somewhat smaller increase in heat flux. The traditional approaches using natural convection and forced-air cooling are becoming less viable as power levels increase. This paper provides a high-level overview of the thermal management problem from the perspective of a practitioner, as well as speculation on the prospects for electronics thermal engineering in years to come.

  3. Thermal management of electronics: Energy conversion issues

    Bar-Cohen, A.

  4. Thermal management roadmap: Cooling electronic products from hand-held dvices to supercomputers

    Chu, R.C.; Bar-Cohen, Avi; Edwards, David; Herrlin, Magnus; Price, Donald; Schmidt, Roger; Joshi, Jogenda; Chryser, George M.; Garimella, Suresh; Mok, Larry; Sammakia, Bahgat; Yeh, Lian-Tuu

  5. Nanostructures and energy conversion

    Dresselhaus, M.S.
    The unique properties of nanostructures associated with their low dimensionality give rise to new opportunities for research on nanoscale heat transfer and energy conversion. Inspired by Majumdar’s analysis of the novel aspects of heat, mass, and charge flow across the interface between hard and soft materials, some perspectives about research frontiers in nanoscale heat transfer and energy conversion are provided.

  6. Nanoscale heat transfer and information technology

    Chen, Gang
    The summary from Goodson’s group on their recent work on heat transfer issues in the microelectronics and data storage industries illustrate the critical role of heat transfer for some areas of information technology. In this article, we build on their work and discuss some directions worthy of further research.

  7. Microscale thermal engineering of electronic systems

    Goodson, K.E.
    The electronics industry is encountering thermal challenges and opportunities with lengthscales comparable to or much less than one micrometer. Examples include nanoscale phonon hotspots in transistors and the increasing temperature rise in onchip interconnects. Millimeter-scale hotspots on microprocessors, resulting from varying rates of power consumption, are being addressed using two-phase microchannel heat sinks. Nanoscale thermal data storage technology has received much attention recently. This paper provides an overview of these topics with a focus on related research at Stanford University.

  8. Comments on papers: Session on advanced energy systems

    Deutch, J.M.

  9. Hydrogen Futures and Technologies

    Forsberg, Charles H.
    Concerns about the security of oil supplies and the environmental consequences of burning fossil fuels have transformed the idea of a hydrogen (H2) economy from science fiction into a political bipartisan vision of our energy future. The challenge is now one of economics and technology. In one context, we already have a rapidly growing H2 economy, driven by the need for increased supplies of H2 to convert more abundant lower-grade crude oils into clean liquid fuels. This development is creating the infrastructure for a global H2 economy and provides powerful incentives to develop better methods of H2 production. The H2 content of liquid fuels is a...

  10. Improving energy efficiency 2-3%/year to save money and avoid global warming

    Rosenfeld, Arthur H.

  11. Nanoscale transport phenomena at the interface of hard and soft matter

    Majumdar, Arun
    Hard and soft matter can be distinguished by the energy of chemical bonds in comparison with kBT. At the interface of hard and soft matter, there exists a region of transition between strong (covalent/ionic/metallic) bonds in solids and weak (van der Waals/hydrogen/electrostatic) interactions in liquids and polymers. Transport of energy and mass at such interfaces is yet to be fully explored, but seems both rich in science and of technological importance. This paper discusses some fundamental issues as well as some technological implications.

  12. Rohsenow Symposium web page

    Lienhard, John H.

  13. Advanced Nuclear Energy Systems: Heat Transfer Issues and Trends

    Corradini, M.L.
    Almost 450 nuclear power plants are currently operating throughout the world and supplying about 17% of the world’s electricity. These plants perform safely, reliably, and have no free-release of byproducts to the environment. Given the current rate of growth in electricity demand and the ever growing concerns for the environment, the US consumer will favor energy sources that can satisfy the need for electricity and other energy-intensive products (1) on a sustainable basis with minimal environmental impact, (2) with enhanced reliability and safety and (3) competitive economics. Given that advances are made to fully apply the potential benefits of nuclear energy systems, the next generation of nuclear...

  14. MEMS-based thermal management of high heat flux devices edifice: Embedded droplet impingement for integrated cooling of electronics

    Amon, Cristina H.
    Increases in microprocessor power dissipation coupled with reductions in feature sizes due to manufacturing process improvements have resulted in continuously increasing heat fluxes. The ever increasing chip-level heat flux has necessitated the development of thermal management devices based on spray and evaporative cooling. This lecture presents a comprehensive review of liquid and evaporative cooling research applied to thermal management of electronics. It also outlines the challenges to practical implementation and future research needs. This presentation also describes the development of EDIFICE: Embedded Droplet Impingement For Integrated Cooling of Electronics. The EDIFICE project seeks to develop an integrated droplet impingement cooling device for removing chip heat fluxes over 100...

  15. Thermal management of electronics: Energy conversion issues

    Bar-Cohen, Avram

  16. Thermal management roadmap: Cooling electronic products from hand-held devices to supercomputers

    Chu, Richard C.

  17. BOILING ENHANCEMENT: RESPONSE TO PROFESSOR A. E. BERGLES

    Hewitt, G.F.

  18. HIGH-FLUX PROCESSES THROUGH ENHANCED HEAT TRANSFER

    Bergles, Arthur E.
    Phase-change processes, such as pool and flow boiling, are generally very effective modes of heat transfer. However, the demands of modern thermal systems have required the development of methods to enhance boiling systems. While heat fluxes above 108W/m2 have been accommodated in carefully controlled situations, the required fluid and the convective conditions usually dictate maximum heat fluxes several orders of magnitude lower. Two major contemporary areas, enhanced surfaces for pool boiling and enhanced surfaces and inserts for forced convection boiling/vaporization, are discussed, as they facilitate the attainment of high heat fluxes. In addition to these passive techniques, active techniques and compound techniques are mentioned. The taxonomy of enhanced heat transfer is covered, and...

  19. PHASE CHANGE HEAT TRANSFER – A PERSPECTIVE FOR THE FUTURE: RESPONSE TO PROFESSOR VIJAY K. DHIR

    Avedisian, C. T.

  20. PHASE CHANGE HEAT TRANSFER – A PERSPECTIVE FOR THE FUTURE

    Dhir, Vijay K.
    During the last half of the twentieth century, significant advances have been made in developing an understanding of phase change heat transfer (e.g., boiling and condensation). Further advances in phase change heat transfer will continue to take place motivated by new technologies such as microelectronics, thermal management in space, advanced terrestrial and space power systems and processing of designed materials. In the past, because of the complexity of the processes, very often we have “oversimplified”, maybe out of necessity, the modeling of the processes. The resulting weaknesses in our models and correlations have continued to haunt us whenever we have encountered new applications. In order to address the phenomena from basic principles,...

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